Senior Packaging Engineer, Intel Corporation
Carter has 30 years of experience working in the high-tech industry between Cray Research, Silicon Graphics, and Intel. The last 22 years of his experience have been focused on non-operational product fragility testing, packaging design and development, package qualification testing, packaging material compliance, and managing corporate-approved packaging suppliers worldwide. He has encountered many changes in packaging material compliance and restrictions during his professional journey. In his current role, Carter develops packaging solutions for Intel’s drone, 3D camera, and artificial intelligence product lines- all of which encounter their own unique challenges when dealing with packaging material compliance and sustainability. Carter holds a B.S. in Industrial Technology from the University of North Dakota and resides near Hillsboro, Oregon with his family.
Why do you want to serve on the SPC Executive Committee?
When considering the many challenges facing current and future generations of this world in relation to material waste and sustainability, the task at hand can seem overwhelming. However, I have attended 4 SPC conferences and continue to be inspired by your coalition’s work in proactively seeking solutions and creating an open source environment for people to learn and participate in. I would like to offer my 23 years of packaging experience to the SPC executive committee in an effort to help move your vision forward while continuing to enhance my learning of the problem at hand and, if possible, be a small part of larger solutions.
Apr 24th, 2018
4:00 pm - 5:00 pm
Metropolitan II and III